U.S. Based Optical Compound Semiconductor Fab
Breakthrough Innovation in Multi-discipline Opto-electronics
With its' world-class team of scientists and engineers, Infinera has a proven track record of delivering game-changing advanced optical solutions. With an in-house optical semiconductor fab (OSF) and revolutionary photonic integrated circuits (PICs), Infinera takes innovative solutions from concept to development to production.
Infinera has a long history of industry firsts, including the first large-scale PIC, the first coherent PIC, the first commercial super-channels, the first Nyquist subcarriers, and the first point-to-multipoint coherent technology. Additional innovation highlights include SD-FEC gain sharing, long-codeword probabilistic constellation shaping (LC-PCS), and dynamic bandwidth allocation (DBA).
Indium Phosphide Compound Semiconductor Fab
At Infinera’s optical semiconductor fab located in Sunnyvale, California, our engineers develop and manufacture industry-leading indium phosphide (InP)-based PICs for use in high-capacity optical networking solutions. InP is a compound semiconductor material ideal for optical functions that cannot be addressed by silicon. Infinera’s revolutionary PICs integrate tuneable lasers, optical amplifiers, high-speed modulators and detectors, and other functions onto a single chip to deliver leading-edge coherent optical transceivers.
Advanced Opto-Electronics Packaging Facility
Located in Allentown, Pennsylvania, our purpose-built facility supports the clean manufacturing and packaging for our advanced optical engine and fiber optic networking technologies. This facility includes more than 20,000 square feet of Class 10,000 manufacturing and lab space, as well as a Class 100 clean room.
Infinera Optical Semiconductor Fab Core Disciplines
Core OSF disciplines include coherent ASIC/DSP design, PIC design and manufacturing, analog ASIC design, advanced packaging design and manufacturing, and holistic co-design, including the RF interconnect. Developing all these component technologies in house, as well as packaging them into the final module in house, ensures that industry-leading performance and capabilities can be delivered in our final products.
Infinera ICE6 and XR Optics Innovation Recognized by Lightwave
Building on the achievements of our optical semiconductor fab, Infinera is honored to be recognized by Lightwave as part of their 2021 Innovation Reviews. With distinguished scores of 4.5 out of 5 from an independent industry panel, both ICE6 and XR optics stood out in the Optical Transport Systems category, reinforcing our industry leadership and track record of best-in-class innovation.
The ASIC/DSP plays a critical role in coherent transceivers. In addition to coherent signal processing, it is responsible for advanced functions such as Nyquist subcarriers, PCS, SD-FEC gain sharing, and DBA. Our OSF has been responsible for multiple generations of ASIC/DSP, including ICE4 and ICE6.
Infinera pioneered photonic integration with the industry’s first large-scale PIC in 2005. Leveraging high-performance InP, Infinera’s PICs reduce cost, footprint, and power consumption while improving performance and reliability. In addition, Infinera has invested heavily to build its own state-of-the-art InP PIC fab.
Analog Electronics Design
Coherent transceivers require high-performance analog electronics. These include drivers that convert the low voltages from the ASIC/DSP to the higher voltages required by modulators, as well as transimpedance amplifiers that convert current from the photodetectors to the voltages required by the ASIC/DSP.
Advanced Packaging and Holistic Co-design
An additional area of OSF expertise is the packaging of coherent transceivers leveraging the latest materials, design methodologies, and manufacturing techniques. And with everything designed in house, holistic co-design optimizes any trade-offs in order to maximize performance.
The Advantages of Indium Phosphide Photonic Integration in High-performance Coherent Optics
With superior performance, smaller form factors, and lower power consumption, highly integrated indium phosphide PICs are a key enabler for high-end coherent transceivers.