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U.S. Based Optical Compound Semiconductor Fab

Breakthrough Innovation in Multi-discipline Opto-electronics

With its' world-class team of scientists and engineers, Infinera has a proven track record of delivering game-changing advanced optical solutions. With an in-house optical semiconductor fab (OSF) and revolutionary photonic integrated circuits (PICs), Infinera takes innovative solutions from concept to development to production.

Infinera has a long history of industry firsts, including the first large-scale PIC, the first coherent PIC, the first commercial super-channels, the first Nyquist subcarriers, and the first point-to-multipoint coherent technology. Additional innovation highlights include SD-FEC gain sharing, long-codeword probabilistic constellation shaping (LC-PCS), and dynamic bandwidth allocation (DBA).

Optical Innovation Center Lab
person in Infinera's Indium Phosphide Compound Semiconductor Fab

Advanced Opto-Electronics Packaging Facility

Located in Allentown, Pennsylvania, our purpose-built facility supports the clean manufacturing and packaging for our advanced optical engine and fiber optic networking technologies. This facility includes more than 20,000 square feet of Class 10,000 manufacturing and lab space, as well as a Class 100 clean room.

Lady working in Infinera's Opto-Electronics Packaging Facility
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Optical Fiber and 2021 Lightwave Innovation Reviews logo


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The ASIC/DSP plays a critical role in coherent transceivers. In addition to coherent signal processing, it is responsible for advanced functions such as Nyquist subcarriers, PCS, SD-FEC gain sharing, and DBA. Our OSF has been responsible for multiple generations of ASIC/DSP, including ICE4 and ICE6.

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PIC Design/Manufacture

Infinera pioneered photonic integration with the industry’s first large-scale PIC in 2005. Leveraging high-performance InP, Infinera’s PICs reduce cost, footprint, and power consumption while improving performance and reliability. In addition, Infinera has invested heavily to build its own state-of-the-art InP PIC fab.

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Analog Electronics Design

Coherent transceivers require high-performance analog electronics. These include drivers that convert the low voltages from the ASIC/DSP to the higher voltages required by modulators, as well as transimpedance amplifiers that convert current from the photodetectors to the voltages required by the ASIC/DSP.

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Advanced Packaging and Holistic Co-design

An additional area of OSF expertise is the packaging of coherent transceivers leveraging the latest materials, design methodologies, and manufacturing techniques. And with everything designed in house, holistic co-design optimizes any trade-offs in order to maximize performance.

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The Advantages of Indium Phosphide Photonic Integration in High-performance Coherent Optics

With superior performance, smaller form factors, and lower power consumption, highly integrated indium phosphide PICs are a key enabler for high-end coherent transceivers.

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Related Resources

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Solution Note

Infinera’s ICE-X Portfolio of Intelligent Coherent Pluggables

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Application Note

ICE6 for Challenging Terrestrial Conditions

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White Paper

Pluggables, Embeddeds, and the Three Vectors of Coherent Evolution

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Press Release

Infinera Breaks Industry Record with 800G Transmission over 950 Kilometers in a Live Network Trial

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ICE6 Optical Engine - Minimize Total Cost of Ownership with 800G Generation Coherent

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Press Release

Infinera and Corning Achieve 800G Across 800 Kilometers with ICE6

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Solution Brief

XR Optics: Innovative Point-to-Multipoint Coherent that Slashes Aggregation Network TCO

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800G: Getting More Capacity Over Longer Distances

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Happy Birthday, Harry Nyquist

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History of Opto-electronic Innovation

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