Innovation: Optical Innovation Center | PICs, Super-channels XR Optics
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Optical Innovation Center

Breakthrough Innovation in Multi-discipline Opto-electronic R&D

The Optical Innovation Center (OIC) comprises a world-class team of scientists and engineers with a proven track record of delivering game-changing advanced optical solutions. A highly vertically integrated organization, the OIC takes innovative solutions from conception to development to production.

The OIC has a long history of industry firsts, including the first large-scale PIC, the first coherent PIC, the first commercial super-channels, the first Nyquist subcarriers, and the first point-to-multipoint coherent technology. Additional OIC innovation highlights include SD-FEC gain sharing, long-codeword probabilistic constellation shaping (LC-PCS), and dynamic bandwidth allocation (DBA).

Optical Innovation Center Lab
Fiber optic cables with a blue hue

Highlights

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ASIC/DSP Design

The ASIC/DSP plays a critical role in coherent transceivers. In addition to coherent signal processing, it is responsible for advanced functions such as Nyquist subcarriers, probabilistic constellation shaping, SD-FEC gain sharing, and dynamic bandwidth allocation. The OIC has been responsible for multiple generations of ASIC/DSP, including for ICE4 and ICE6.

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PIC Design/Manufacture

Infinera pioneered photonic integration with the industry’s first large-scale PIC in 2005. Leveraging high-performance InP, Infinera’s PICs reduce cost, footprint, and power consumption while improving performance and reliability. In addition, Infinera has invested heavily to build its own state-of-the-art indium phosphide PIC fab.

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Analog Electronics Design

Coherent transceivers require high-performance analog electronics. These include drivers that convert the low voltages from the ASIC/DSP to the higher voltages required by modulators, as well as transimpedance amplifiers (TIAs) that convert current from the photodetectors to the voltages required by the ASIC/DSP.

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Advanced Packaging and Holistic Co-design

An additional area of OIC expertise is the packaging of coherent transceivers leveraging the latest materials, design methodologies, and manufacturing techniques. And with everything designed in-house, holistic co-design optimizes any trade-offs in order to maximize performance.

White Paper

The Advantages of Indium Phosphide Photonic Integration in High-performance Coherent Optics

With superior performance, smaller form factors, and lower power consumption, highly integrated indium phosphide PICs are a key enabler for high-end coherent transceivers.

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Related Resources

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Brochure

Optical Innovation Center

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White Paper

Pluggables, Embeddeds, and the Three Vectors of Coherent Evolution

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Press Release

Infinera Breaks Industry Record with 800G Transmission over 950 Kilometers in a Live Network Trial

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Brochure

ICE6 Optical Engine - Minimize Total Cost of Ownership with 800G Generation Coherent

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Press Release

Infinera and Corning Achieve 800G Across 800 Kilometers with ICE6

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Solution Brief

XR Optics: Innovative Point-to-Multipoint Coherent that Slashes Aggregation Network TCO

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Webinar

XR Optics – The Role of Coherent Subcarrier Aggregation in Next-Generation Aggregation Network Architectures

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Video

800G: Getting More Capacity Over Longer Distances

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Blog

Happy Birthday, Harry Nyquist

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Infographic

History of Opto-electronic Innovation

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