Breakthrough Innovation in Multi-discipline Opto-electronic R&D
The Optical Innovation Center (OIC) comprises a world-class team of scientists and engineers with a proven track record of delivering game-changing advanced optical solutions. A highly vertically integrated organization, the OIC takes innovative solutions from conception to development to production.
The OIC has a long history of industry firsts, including the first large-scale PIC, the first coherent PIC, the first commercial super-channels, the first Nyquist subcarriers, and the first point-to-multipoint coherent technology. Additional OIC innovation highlights include SD-FEC gain sharing, long-codeword probabilistic constellation shaping (LC-PCS), and dynamic bandwidth allocation (DBA).
Infinera Optical Innovation Center Core Disciplines
Core OIC disciplines include coherent ASIC/DSP design, photonic integrated circuit (PIC) design and manufacturing, analog ASIC design, advanced packaging design and manufacturing, and holistic co-design, including the RF interconnect. Developing all these component technologies in-house, as well as packaging them into the final module in-house, ensures that industry-leading performance and capabilities can be delivered in the final products.
The ASIC/DSP plays a critical role in coherent transceivers. In addition to coherent signal processing, it is responsible for advanced functions such as Nyquist subcarriers, probabilistic constellation shaping, SD-FEC gain sharing, and dynamic bandwidth allocation. The OIC has been responsible for multiple generations of ASIC/DSP, including for ICE4 and ICE6.
Infinera pioneered photonic integration with the industry’s first large-scale PIC in 2005. Leveraging high-performance InP, Infinera’s PICs reduce cost, footprint, and power consumption while improving performance and reliability. In addition, Infinera has invested heavily to build its own state-of-the-art indium phosphide PIC fab.
Analog Electronics Design
Coherent transceivers require high-performance analog electronics. These include drivers that convert the low voltages from the ASIC/DSP to the higher voltages required by modulators, as well as transimpedance amplifiers (TIAs) that convert current from the photodetectors to the voltages required by the ASIC/DSP.
Advanced Packaging and Holistic Co-design
An additional area of OIC expertise is the packaging of coherent transceivers leveraging the latest materials, design methodologies, and manufacturing techniques. And with everything designed in-house, holistic co-design optimizes any trade-offs in order to maximize performance.
The Advantages of Indium Phosphide Photonic Integration in High-performance Coherent Optics
With superior performance, smaller form factors, and lower power consumption, highly integrated indium phosphide PICs are a key enabler for high-end coherent transceivers.