Photonic Integration

In the world of microprocessors, we have seen tremendous increases in computational power with simultaneous decreases in cost and power consumption resulting from integration and standardized semiconductor manufacturing processes. The integration of optical components and functions into large scale photonic integrated circuits (PIC) and the use of semiconductor manufacturing processes for PICs has been pioneered by Infinera, and shows significant benefits when integrated into a DWDM system. Infinera’s integration approach, first on the DTN at 100G and now on the DTN-X at 500G per pair of chips, enables significant power, space and cost savings for long haul DWDM applications.